The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Jan. 24, 2018
Applicant:
Osram Opto Semiconductors Gmbh, Regensburg, DE;
Inventors:
Assignee:
OSRAM OLED GmbH, Regensburg, DE;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/78 (2006.01); H01L 25/00 (2006.01); H01L 23/00 (2006.01); H01L 21/52 (2006.01);
U.S. Cl.
CPC ...
H01L 21/6836 (2013.01); H01L 21/52 (2013.01); H01L 21/78 (2013.01); H01L 24/97 (2013.01); H01L 25/50 (2013.01); H01L 2221/68322 (2013.01); H01L 2221/68327 (2013.01); H01L 2221/68368 (2013.01); H01L 2221/68381 (2013.01);
Abstract
A method of selecting semiconductor chips includes: A) providing the semiconductor chips in a composite, B) producing a cohesive, mechanical first connection between the semiconductor chips and a carrier film, C) singulating the semiconductor chips, wherein the carrier film mechanically connects the semiconductor chips to one another after singulation, D) selectively weakening the first connection between some singulated semiconductor chips and the carrier film, depending on electro-optical and/or electrical properties of the semiconductor chips, and E) removing the semiconductor chips whose first connection is selectively weakened from the carrier film.