logo

For the Inventor, By the Inventor

The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11255524 B1

PDFFull Text
Date of Patent:
Feb. 22, 2022

Filed:

May. 29, 2020

Light emitting device

Applicant:

Epistar Corporation, Hsinchu, TW;

Inventors:

Chi-Chih Pu, Taoyuan County, TW;

Chen-Hong Lee, Taoyuan County, TW;

Shih-Yu Yeh, Taoyuan County, TW;

Wei-Kang Cheng, Taoyuan County, TW;

Shyi-Ming Pan, Taoyuan County, TW;

Siang-Fu Hong, Taoyuan County, TW;

Chih-Shu Huang, Taoyuan County, TW;

Tzu-Hsiang Wang, Taoyuan County, TW;

Shih-Chieh Tang, Taoyuan County, TW;

Cheng-Kuang Yang, Taoyuan County, TW;

Assignee:

EPISTAR CORPORATION, Hsinchu, TW;

Attorney:

Muncy, Geissler, Olds & Lowe, P.C.

Primary Examiner:

Ashok Patel

Int. Cl.
CPC ...
F21V 21/14 (2006.01); H01L 33/50 (2010.01); H01L 33/48 (2010.01); H01L 33/44 (2010.01); F21K 9/232 (2016.01); F21V 21/00 (2006.01); H01L 25/075 (2006.01); F21V 29/85 (2015.01); F21V 3/02 (2006.01); F21V 17/10 (2006.01); F21V 23/06 (2006.01); H01L 23/00 (2006.01); H01L 33/00 (2010.01); F21Y 107/00 (2016.01); F21Y 115/10 (2016.01);
U.S. Cl.
CPC ...
F21V 21/14 (2013.01); F21K 9/232 (2016.08); F21V 3/02 (2013.01); F21V 17/10 (2013.01); F21V 21/00 (2013.01); F21V 23/06 (2013.01); F21V 29/85 (2015.01); H01L 25/0753 (2013.01); H01L 33/44 (2013.01); H01L 33/486 (2013.01); H01L 33/50 (2013.01); H01L 33/508 (2013.01); F21Y 2107/00 (2016.08); F21Y 2115/10 (2016.08); H01L 24/14 (2013.01); H01L 24/16 (2013.01); H01L 24/48 (2013.01); H01L 24/49 (2013.01); H01L 33/007 (2013.01); H01L 2224/1403 (2013.01); H01L 2224/14051 (2013.01); H01L 2224/16 (2013.01); H01L 2224/16225 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/45147 (2013.01); H01L 2224/48091 (2013.01); H01L 2224/48137 (2013.01); H01L 2224/48227 (2013.01); H01L 2224/48465 (2013.01); H01L 2224/49107 (2013.01); H01L 2224/73204 (2013.01); H01L 2224/73265 (2013.01); H01L 2224/83385 (2013.01); H01L 2224/8592 (2013.01); H01L 2924/00011 (2013.01); H01L 2924/00014 (2013.01); H01L 2924/01322 (2013.01); H01L 2924/12041 (2013.01); H01L 2924/19107 (2013.01); H01L 2924/3025 (2013.01);
Abstract

A light-emitting device including a substrate with a top surface and a bottom surface opposite to the top surface and a plurality of LED chips disposed on the top surface and configured to generate a top light visible above the top surface and a bottom light visible beneath the bottom surface, each LED chip comprising a plurality of light-emitting surfaces. The substrate has a thickness greater than 200 μm and comprises aluminum oxide, sapphire, glass, plastic, or rubber. The plurality of LED chips has an incident light with a wavelength of 420-470 nm. The top light and the bottom light have a color temperature difference of not greater than 1500K.

Find Patent Forward Citations

Loading…