Copper alloy and application thereof

Abstract

The present invention discloses a copper alloy, which includes: 5 wt % to 15 wt % of Zn, 0.2 wt % to 2.5 wt % of Sn, 0.1 wt % to 2.0 wt % of Ni, 0.01 wt % to 0.3 wt % of P, 0 to 0.3 wt % of Mg, 0 to 0.5 wt % of Fe, and a balance of Cu and inevitable impurities. Preferably, it is controlled that 1.0 wt %≤Ni+Sn≤3.5 wt %, the weight ratio of Ni to Sn is 0.08 to 10; the weight ratio of Ni to P is 2 to 15, Ni and P form a NiP compound in a matrix. During the crystal orientation analysis using EBSD measurement, the area in a Brass orientation {011}<211> at a derivation angle of less than 15° accounts for 10% to 25%. The yield strength 600 MPa, the electrical conductivity is ≥25% IACS, and the bending machinability is excellent because the value R/t in a GW direction is ≤1 and the value R/t in a BW direction is ≤2.