The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2022

Filed:

Jan. 22, 2020
Applicant:

Geckos Technology Corp., Zhubei, TW;

Inventors:

Wei-Chen Chang, Zhubei, TW;

Tsung-Huan Sheng, Zhubei, TW;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09D 5/24 (2006.01); C09D 7/40 (2018.01); C09D 7/61 (2018.01); C09D 7/65 (2018.01); C09D 7/20 (2018.01); C09D 101/26 (2006.01); C09D 161/06 (2006.01); C09D 163/00 (2006.01); C09D 11/52 (2014.01); C09D 11/037 (2014.01); C09D 11/033 (2014.01); C09D 11/14 (2006.01); C09D 11/103 (2014.01); C09D 11/102 (2014.01); C09D 11/322 (2014.01); C09D 11/36 (2014.01); H01B 1/16 (2006.01); H01B 1/22 (2006.01); H01L 31/0224 (2006.01); H05K 1/09 (2006.01);
U.S. Cl.
CPC ...
C09D 5/24 (2013.01); C09D 7/20 (2018.01); C09D 7/61 (2018.01); C09D 7/65 (2018.01); C09D 7/67 (2018.01); C09D 7/68 (2018.01); C09D 7/69 (2018.01); C09D 11/033 (2013.01); C09D 11/037 (2013.01); C09D 11/102 (2013.01); C09D 11/103 (2013.01); C09D 11/14 (2013.01); C09D 11/322 (2013.01); C09D 11/36 (2013.01); C09D 11/52 (2013.01); C09D 101/26 (2013.01); C09D 161/06 (2013.01); C09D 163/00 (2013.01); H01B 1/16 (2013.01); H01B 1/22 (2013.01); H01L 31/0224 (2013.01); H05K 1/097 (2013.01);
Abstract

The present invention discloses an oxidation-resistant conductive copper past, a manufacturing method and a use thereof. The oxidation-resistant conductive copper paste comprises 70 wt % to 90 wt % of copper particles, a binder, a thixotropic agent and a solvent. The manufacturing method comprises the steps of mixing the binder, the thixotropic agent and ethanol thoroughly to obtain a first mixture; mixing the solvent with the first mixture thoroughly to obtain a second mixture; mixing the copper particles with the second mixture to obtain a conductive copper paste precursor; and removing the ethanol from the conductive copper paste precursor to obtain the oxidation-resistant conductive copper paste. The oxidation-resistant conductive copper paste can be used for manufacturing a conductive film of a circuit board or an electrode of a solar battery by a printing process.


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