The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2022

Filed:

Sep. 13, 2017
Applicant:

Waps Co., Ltd., Busan, KR;

Inventors:

Jae Chun Lee, Busan, KR;

Sang Hoon Ha, Busan, KR;

Assignee:

WAPS CO., LTD, Busan, KR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08L 9/06 (2006.01); B29C 48/21 (2019.01); B29C 48/07 (2019.01); B32B 27/08 (2006.01); B32B 27/20 (2006.01); B32B 27/32 (2006.01); B32B 37/02 (2006.01); B32B 37/10 (2006.01); B32B 27/42 (2006.01); B32B 27/16 (2006.01); B32B 27/06 (2006.01); B29C 48/00 (2019.01); B32B 27/28 (2006.01); B32B 27/30 (2006.01); B32B 37/15 (2006.01); E04F 15/10 (2006.01); B29K 9/06 (2006.01); B29K 23/00 (2006.01); B29L 31/00 (2006.01);
U.S. Cl.
CPC ...
C08L 9/06 (2013.01); B29C 48/0021 (2019.02); B29C 48/21 (2019.02); B32B 27/08 (2013.01); B32B 27/20 (2013.01); B32B 27/285 (2013.01); B32B 27/302 (2013.01); B32B 27/308 (2013.01); B32B 27/32 (2013.01); B32B 37/02 (2013.01); B32B 37/10 (2013.01); B32B 37/153 (2013.01); E04F 15/107 (2013.01); B29K 2009/06 (2013.01); B29K 2023/065 (2013.01); B29K 2023/0625 (2013.01); B29K 2023/12 (2013.01); B29L 2031/732 (2013.01); B32B 2250/24 (2013.01); B32B 2305/30 (2013.01); B32B 2307/306 (2013.01); B32B 2307/584 (2013.01); B32B 2307/734 (2013.01); B32B 2323/043 (2013.01); B32B 2323/046 (2013.01); B32B 2323/10 (2013.01); B32B 2325/00 (2013.01); B32B 2333/12 (2013.01); B32B 2371/00 (2013.01); B32B 2419/04 (2013.01); C08L 2205/025 (2013.01); C08L 2205/035 (2013.01);
Abstract

Described herein is flooring formed of an eco-friendly material, where the flooring has excellent heat resistance, durability, abrasion resistance and dimensional stability, and is formed of a non-PVC material and thus is recyclable via an extrusion processing at the time of disposal after use. Specifically, eco-friendly flooring is described in which a coating layer, an overlayer having ionomers, a printing layer, at least one middle layer, and at least one underlayer are laminated in order, where the overlayer of the flooring has ionomers, at least one of the middle layer and the underlayer has a thermoplastic polyolefin-based resin, a styrene-based resin, oil, and a filler, the thermoplastic polyolefin-based resin is contained in an amount of 50 to 150 parts by weight with respect to 100 parts by weight of the styrene-based resin, and the styrene-based resin may contain 25 to 45% styrene.


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