The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 22, 2022
Filed:
Jun. 11, 2020
Nanjing University of Aeronautics and Astronautics, Nanjing, CN;
Nanjing Li-hang Industry Institute of Bionic Technology Limited Company, Nanjing, CN;
Zhendong Dai, Nanjing, CN;
Keju Ji, Nanjing, CN;
Enhua Cui, Nanjing, CN;
Jian Chen, Nanjing, CN;
Cong Yuan, Nanjing, CN;
Yiqiang Tang, Nanjing, CN;
Abstract
A preparation method of a bionic adhesive material with a tip-expanded microstructural array includes the following steps: machining through-holes on a metal sheet; modifying morphology of a through-hole by electroplating, using the metal sheet in step 1 as an electroplating cathode, and arranging the electroplating cathode and an electroplating anode in parallel to prepare a hyperboloid-like through-hole array assembly, fitting a lower surface of the hyperboloid-like through-hole array assembly tightly to an upper surface of a substrate assembly to prepare a through-hole assembly of a mold; and filling the mold assembly with a polymer, curing, and demolding to obtain the adhesive material with the tip-expanded microstructural array.