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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11254487 B1

PDFFull Text
Date of Patent:
Feb. 22, 2022

Filed:

Feb. 21, 2018

Molding head

Applicant:

Yoshino Kogyosho Co., Ltd., Tokyo, JP;

Inventor:

Mai Kase, Tokyo, JP;

Assignee:

YOSHINO KOGYOSHO CO., LTD., Tokyo, JP;

Attorney:

Oliff PLC

Primary Examiner:

Frederick C Nicolas

Int. Cl.
CPC ...
B65D 83/14 (2006.01); B65D 83/30 (2006.01); B65D 83/20 (2006.01); B65D 47/32 (2006.01); B05B 1/14 (2006.01); B65D 83/36 (2006.01); B65D 83/38 (2006.01); B65D 83/48 (2006.01); B05B 11/00 (2006.01); B65D 83/40 (2006.01);
U.S. Cl.
CPC ...
B65D 83/14 (2013.01); B05B 1/14 (2013.01); B65D 47/32 (2013.01); B65D 83/20 (2013.01); B65D 83/205 (2013.01); B65D 83/30 (2013.01); B65D 83/753 (2013.01); B05B 11/3053 (2013.01); B65D 83/36 (2013.01); B65D 83/38 (2013.01); B65D 83/40 (2013.01); B65D 83/48 (2013.01); B65D 83/75 (2013.01);
Abstract

A molding head includes: an outer casing unit that has a top wall portion which is installed above a discharge hole and in which a plurality of shaping holes are formed, and that causes a molding surface of the top wall portion to discharge the content which has passed through the shaping holes; and an inner plate that is disposed inside the outer casing unit and defines a dispersion chamber between the inner plate and a supply surface of the top wall portion, in which a guide protrusion portion with which the content collides to be introduced to openings of the shaping holes on the molding surface side is formed on at least one of inner surfaces of the plurality of shaping holes, or in at least one of circumferential opening edge portions of the plurality of shaping holes on the supply surface side.

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Kase, Mai. (2022). Molding head (U.S. Patent No. 11254487). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11254487

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