The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2022

Filed:

Jan. 29, 2019
Applicants:

Murakami Corporation, Shizuoka, JP;

Honda Motor Co., Ltd., Tokyo, JP;

Inventors:

Naomi Sugimura, Shimada, JP;

Tatsuya Ohmaru, Wako, JP;

Manami Inai, Utsunomiya, JP;

Assignees:

MURAKAMI CORPORATION, Shizuoka, JP;

HONDA MOTOR CO., LTD., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B60R 1/04 (2006.01); B60R 1/12 (2006.01);
U.S. Cl.
CPC ...
B60R 1/04 (2013.01); B60R 1/12 (2013.01); B60R 2001/1215 (2013.01); B60R 2001/1223 (2013.01); B60R 2001/1261 (2013.01);
Abstract

A sensor assembling structure includes a sensor assembling void formed in a mounting base, a sensor assembling leaf spring, and mounting base-side leaf spring mounting portions formed at the mounting base. The mounting base is mounted to a windshield. The sensor assembling void receives a sensor. The sensor assembling leaf spring includes mounting base mounted portions. In a state in which the sensor is received in the sensor assembling void, the sensor assembling leaf spring is mounted to the mounting base-side leaf spring mounting portions via the mounting base mounted portions. The sensor assembling leaf spring maintains a state in which the sensor is received in the sensor assembling void.


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