The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 22, 2022

Filed:

Jun. 12, 2019
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Teruhito Azuma, Anan, JP;

Toru Hashimoto, Tokushima, JP;

Tadao Morino, Anan, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29D 11/00 (2006.01); H01L 33/56 (2010.01); H01L 33/60 (2010.01); B29L 11/00 (2006.01); B29K 105/16 (2006.01);
U.S. Cl.
CPC ...
B29D 11/0074 (2013.01); H01L 33/56 (2013.01); H01L 33/60 (2013.01); B29K 2105/16 (2013.01); B29L 2011/0083 (2013.01); H01L 2933/005 (2013.01);
Abstract

A method for manufacturing a light emitting device includes: preparing a baseplate having a plate surface on which a protrusion is disposed; forming a first resin frame having an opening on the plate surface, wherein the opening is located above the protrusion; forming a second resin in the opening; detaching the baseplate; bonding a light emitting element to a surface of the second resin surface that has been exposed as a result of detaching the baseplate; and forming a third resin that surrounds lateral faces of the light emitting element and that covers and contacts a portion of the first resin frame.


Find Patent Forward Citations

Loading…