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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11254043 B1

PDFFull Text
Date of Patent:
Feb. 22, 2022

Filed:

Dec. 23, 2018

High-accuracy contactless measurement method for measuring temperature of metal thermoforming mold

Applicant:

National Chung-shan Institute of Science and Technology, Taoyuan, TW;

Inventors:

Shiang-Feng Tang, Taoyuan, TW;

Shun-Lung Yen, Taoyuan, TW;

Kun-Chi Lo, Taoyuan, TW;

Wen-Jen Lin, Taoyuan, TW;

Assignee:

National Chung-Shan Institute of Science and Technology, Taoyuan, TW;

Attorney:

Winston Hsu

Primary Examiner:

Gail Kaplan Verbitsky

Int. Cl.
CPC ...
G01J 5/00 (2006.01); B29C 51/46 (2006.01); G01K 13/00 (2021.01); B29C 51/30 (2006.01); B29C 51/18 (2006.01); G01J 5/56 (2006.01); G01J 5/06 (2022.01); G01J 5/24 (2006.01); G01J 5/52 (2022.01); G01N 21/27 (2006.01);
U.S. Cl.
CPC ...
B29C 51/46 (2013.01); B29C 51/18 (2013.01); B29C 51/30 (2013.01); G01J 5/06 (2013.01); G01J 5/24 (2013.01); G01J 5/522 (2013.01); G01J 5/56 (2013.01); G01K 13/00 (2013.01); G01N 21/274 (2013.01); G01J 2005/0048 (2013.01); G01J 2005/0051 (2013.01); G01J 2005/0077 (2013.01); G01J 2005/068 (2013.01);
Abstract

The present invention aims at providing a high-accuracy contactless measurement method for measuring the temperature of a metal thermoforming mold, which is capable of timely monitoring the metal temperature in multiple areas and also has threshold warning functionalities for delivering real-time notifications, in order to save the labor costs for long-term monitoring.

Find Patent Forward Citations

Tang, Shiang-Feng. (2022). High-accuracy contactless measurement method for measuring temperature of metal thermoforming mold (U.S. Patent No. 11254043). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11254043

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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