The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Nov. 01, 2018
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Tae Kyung Lee, Suwon-si, KR;
Kwang Su Kim, Suwon-si, KR;
Sang Jin Kim, Suwon-si, KR;
Seung Wook Park, Suwon-si, KR;
Jong Beom Kim, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H03H 9/10 (2006.01); H03H 3/02 (2006.01); H03H 9/17 (2006.01); H03H 9/05 (2006.01);
U.S. Cl.
CPC ...
H03H 9/105 (2013.01); H03H 3/02 (2013.01); H03H 9/0514 (2013.01); H03H 9/174 (2013.01); H03H 9/173 (2013.01); H03H 2003/023 (2013.01);
Abstract
An acoustic resonator package includes a substrate, an acoustic resonator disposed on the substrate, the acoustic resonator including a first hydrophobic layer, a cap configured to accommodate the acoustic resonator, a bonding portion configured to bond the substrate to the cap, and a second hydrophobic layer disposed on the substrate at a position between the acoustic resonator and the bonding portion.