The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Apr. 20, 2020
International Business Machines Corporation, Armonk, NY (US);
Tianji Zhou, Albany, NY (US);
Saumya Sharma, Albany, NY (US);
Ashim Dutta, Menands, NY (US);
Chih-Chao Yang, Glenmont, NY (US);
International Business Machines Corporation, Armonk, NY (US);
Abstract
A method includes forming a first metallization layer containing a first metal-containing line and a second metal-containing line disposed in a first interlevel dielectric layer. The first metal-containing line includes a first conductive metal and the second metal-containing line includes a second conductive metal. The first metal-containing line and the second metal-containing line are recessed to below a top surface of the interlevel dielectric layer. A metal-containing cap protection layer is deposited in a recessed portion of the first metal-containing line and the second metal-containing line. The metal-containing cap protection layer includes a third conductive metal which is different than the first conductive metal and the second conductive metal.