The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2022

Filed:

Mar. 05, 2019
Applicant:

International Business Machines Corporation, Armonk, NY (US);

Inventors:

Thilo Hermann Curt Stoeferle, Rueschlikon, CH;

Andreas Fuhrer Janett, Zurich, CH;

Stefan Filipp, Zurich, CH;

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
H01L 39/24 (2006.01); H01P 11/00 (2006.01); H01P 7/00 (2006.01); H03H 3/013 (2006.01); H01L 39/12 (2006.01); H01L 39/22 (2006.01); H03H 3/02 (2006.01);
U.S. Cl.
CPC ...
H01L 39/2406 (2013.01); H01L 39/249 (2013.01); H01P 7/00 (2013.01); H01P 11/008 (2013.01); H03H 3/013 (2013.01); H01L 39/12 (2013.01); H01L 39/223 (2013.01); H03H 3/02 (2013.01);
Abstract

A method of an embodiment includes forming a capacitor pad for a nonlinear resonator. In an embodiment, the method includes comparing a resonance frequency of the nonlinear resonator to a target frequency to determine whether the resonance frequency falls within a range of the target frequency. A device of an embodiment includes a first capacitor pad comprising a superconducting material, the first capacitor pad configured to couple to a first end of a logic circuit element. In an embodiment, the device includes a second capacitor pad comprising a second superconducting material, the capacitor pad configured to couple to a second end of the logic circuit element. In an embodiment, the second capacitor pad includes a first portion; a second portion; and a bridge configured to electrically connect the first portion and the second portion.


Find Patent Forward Citations

Loading…