The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2022

Filed:

Jun. 22, 2020
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Mingwei Zhu, San Jose, CA (US);

Sivapackia Ganapathiappan, Los Altos, CA (US);

Boyi Fu, San Jose, CA (US);

Hou T. Ng, Campbell, CA (US);

Nag B. Patibandla, Pleasanton, CA (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/683 (2006.01); H01L 21/66 (2006.01); H01L 27/15 (2006.01); H01L 33/00 (2010.01); H01L 23/00 (2006.01); H01L 33/48 (2010.01); H01L 25/075 (2006.01);
U.S. Cl.
CPC ...
H01L 27/156 (2013.01); H01L 21/6835 (2013.01); H01L 22/22 (2013.01); H01L 24/741 (2013.01); H01L 24/83 (2013.01); H01L 24/97 (2013.01); H01L 33/0095 (2013.01); H01L 33/48 (2013.01); H01L 22/20 (2013.01); H01L 24/75 (2013.01); H01L 25/0753 (2013.01); H01L 2221/68368 (2013.01); H01L 2224/7598 (2013.01); H01L 2224/95136 (2013.01);
Abstract

An apparatus for positioning micro-devices on a substrate includes one or more supports to hold a donor substrate and a destination substrate, an adhesive dispenser to deliver adhesive on micro-devices on the donor substrate, a transfer device including a transfer surface to transfer the micro-devices from the donor substrate to the destination substrate, and a controller. The controller is configured to operate the adhesive dispenser to selectively dispense the adhesive onto selected micro-devices on the donor substrate based on a desired spacing of the selected micro-devices on the destination substrate. The controller is configured to operate the transfer device such that the transfer surface engages the adhesive on the donor substrate to cause the selected micro-devices to adhere to the transfer surface and the transfer surface then transfers the selected micro-devices from the donor substrate to the destination substrate.


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