The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Oct. 31, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventors:
Assignee:
MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/34 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/345 (2013.01); H01L 23/58 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/20105 (2013.01);
Abstract
The present invention concerns a system for allowing the restoration of an interconnection of a die of a power module, a first terminal of the interconnection being fixed on the die and a second terminal of the interconnection being connected to an electric circuit. The system comprises:—at least one material located in the vicinity of the first terminal of the interconnection, the material having a predetermined melting temperature,—means for controlling the temperature of the die at the predetermined melting temperature during a predetermined period of time. The present invention concerns also the method.