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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11251151 B1

PDFFull Text
Date of Patent:
Feb. 15, 2022

Filed:

Oct. 31, 2018

System and method for allowing restoration of interconnection of die of power module

Applicant:

Mitsubishi Electric Corporation, Tokyo, JP;

Inventors:

Jeffrey Ewanchuk, Rennes, FR;

Julio Brandelero, Rennes, FR;

Stefan Mollov, Rennes, FR;

Assignee:

MITSUBISHI ELECTRIC CORPORATION, Tokyo, JP;

Attorney:

Birch, Stewart, Kolasch & Birch, LLP

Primary Examiner:

Jasmine J Clark

Int. Cl.
CPC ...
H01L 23/00 (2006.01); H01L 23/34 (2006.01); H01L 23/58 (2006.01);
U.S. Cl.
CPC ...
H01L 24/32 (2013.01); H01L 23/345 (2013.01); H01L 23/58 (2013.01); H01L 24/29 (2013.01); H01L 24/83 (2013.01); H01L 2224/29111 (2013.01); H01L 2224/29113 (2013.01); H01L 2224/29116 (2013.01); H01L 2224/32225 (2013.01); H01L 2224/83801 (2013.01); H01L 2924/20105 (2013.01);
Abstract

The present invention concerns a system for allowing the restoration of an interconnection of a die of a power module, a first terminal of the interconnection being fixed on the die and a second terminal of the interconnection being connected to an electric circuit. The system comprises:—at least one material located in the vicinity of the first terminal of the interconnection, the material having a predetermined melting temperature,—means for controlling the temperature of the die at the predetermined melting temperature during a predetermined period of time. The present invention concerns also the method.

Find Patent Forward Citations

Ewanchuk, Jeffrey. (2022). System and method for allowing restoration of interconnection of die of power module (U.S. Patent No. 11251151). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11251151

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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