The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Nov. 06, 2018
Applicant:
Samsung Electro-mechanics Co., Ltd., Suwon-si, KR;
Inventors:
Jong In Ryu, Suwon-si, KR;
Suk Youn Hong, Suwon-si, KR;
Gi Su Chi, Suwon-si, KR;
Seung Hyun Hong, Suwon-si, KR;
Ki Chan Kim, Suwon-si, KR;
Assignee:
Samsung Electro-Mechanics Co., Ltd., Suwon-si, KR;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/552 (2006.01); H01L 23/538 (2006.01); H01L 23/31 (2006.01); H01L 25/00 (2006.01); H01L 21/56 (2006.01); H01L 25/16 (2006.01); H01L 23/66 (2006.01);
U.S. Cl.
CPC ...
H01L 23/552 (2013.01); H01L 21/565 (2013.01); H01L 23/3121 (2013.01); H01L 23/5383 (2013.01); H01L 23/5386 (2013.01); H01L 23/66 (2013.01); H01L 25/16 (2013.01); H01L 25/50 (2013.01); H01L 2223/6677 (2013.01);
Abstract
An electronic device module includes a substrate, at least one first component and at least one second component disposed on one surface of the substrate, a second sealing portion having the at least one second component embedded therein, and disposed on the substrate, and a first sealing portion disposed outside of the second sealing portion, at least a portion of the first sealing portion being disposed between the at least one first component and the substrate.