The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Mar. 13, 2018
Applicant:
Sharp Kabushiki Kaisha, Sakai, JP;
Inventor:
Hiroyoshi Higashisaka, Sakai, JP;
Assignee:
SHARP KABUSHIKI KAISHA, Sakai, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/544 (2006.01); H01L 33/00 (2010.01); H01L 25/075 (2006.01); H01L 33/62 (2010.01);
U.S. Cl.
CPC ...
H01L 23/544 (2013.01); H01L 25/0753 (2013.01); H01L 33/0093 (2020.05); H01L 33/62 (2013.01); H01L 2223/54426 (2013.01); H01L 2933/0066 (2013.01);
Abstract
A semiconductor module includes a base material, an alignment mark provided on a surface of the base material and plural semiconductor elements that are individually provided on the surface of the base material while being juxtaposed to the alignment mark and that are separated from each other. Accordingly, a semiconductor module and a method for manufacturing the semiconductor module are provided which may prevent an alignment mark from being peeled off and remaining as a foreign object and may improve reliability.