The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11251110 B1

Date of Patent:

Feb. 15, 2022

Filed:

Jan. 17, 2019

Semiconductor device and method of manufacturing the semiconductor device

Applicant:

Ablic Inc., Chiba, JP;

Inventor:

Kiyoaki Kadoi, Chiba, JP;

Assignee:

ABLIC INC., Chiba, JP;

Attorney:

Crowell & Moring LLP

Primary Examiner:

Lauren R Bell

Int. Cl.

CPC ...

H01L 23/495 (2006.01); H01L 23/31 (2006.01); H01L 21/56 (2006.01); H01L 21/48 (2006.01); H01L 21/78 (2006.01); H01L 23/00 (2006.01);

U.S. Cl.

CPC ...

H01L 23/49503 (2013.01); H01L 21/4828 (2013.01); H01L 21/4842 (2013.01); H01L 21/561 (2013.01); H01L 21/78 (2013.01); H01L 23/3121 (2013.01); H01L 23/49548 (2013.01); H01L 24/49 (2013.01);

Abstract

In a semiconductor device (), a semiconductor chip () is mounted on a die pad () which has a die pad overhang portion () and leads () are arranged around and apart from the die pad (). The leads () and the semiconductor chip () are electrically connected and are covered with a sealing resin (). A concave portion () is formed on the outer side of each lead (), i.e., the far side from the die pad. A lead concave surface () facing the concave portion () includes a forward-tapered lead slope surface (). Side surface of the sealing resin () has a step of a staircase shape formed from the first and the second resin side surfaces (and). A tip of the lead () protrudes past the first resin side surface ().

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