The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Feb. 25, 2020
Applicant:
Fuji Electric Co., Ltd., Kawasaki, JP;
Inventor:
Taichi Itoh, Matsumoto, JP;
Assignee:
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/36 (2006.01); H01L 23/48 (2006.01); H01L 23/055 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H05K 1/14 (2006.01);
U.S. Cl.
CPC ...
H01L 23/36 (2013.01); H01L 23/055 (2013.01); H01L 23/48 (2013.01); H01L 25/072 (2013.01); H01L 25/18 (2013.01); H05K 1/142 (2013.01);
Abstract
A main ceramic circuit board on which a semiconductor element is arranged is separate from a sub-ceramic circuit board on which a connection terminal is arranged. Accordingly, heat generated by the semiconductor element is conducted via the main ceramic circuit board and a base plate arranged thereunder and the sub-ceramic circuit board to the connection terminal. That is to say, it is difficult to conduct heat from the semiconductor element to the connection terminal, compared with a case where the connection terminal and the semiconductor element are arranged over the same ceramic circuit board.