The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Nov. 01, 2017
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Yosuke Nakata, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/043 (2006.01); H01L 23/057 (2006.01); H01L 23/24 (2006.01); H01L 23/498 (2006.01); H01L 23/373 (2006.01); H01L 23/66 (2006.01); H01L 25/07 (2006.01); H01L 25/18 (2006.01); H01L 25/16 (2006.01);
U.S. Cl.
CPC ...
H01L 23/043 (2013.01); H01L 25/07 (2013.01); H01L 25/18 (2013.01);
Abstract
In the semiconductor device, a screw has a head section embedded in a case groove section provided in a frame placing stage of a case to cause side and front surfaces of the head section to be covered by the case, thereby fixing the screw to the case. A threaded section passes through a frame through hole of a frame exposed section disposed above the head section to protrude upward to be exposed on a side facing away from the base plate.