The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2022

Filed:

Apr. 20, 2020
Applicant:

Canon Kabushiki Kaisha, Tokyo, JP;

Inventors:

Tatusya Hayashi, Utsunomiya, JP;

Yosuke Murakami, Utsunomiya, JP;

Noriyasu Hasegawa, Utsunomiya, JP;

Hirotoshi Torii, Utsunomiya, JP;

Yusuke Tanaka, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G03F 7/00 (2006.01); B82Y 10/00 (2011.01); B82Y 40/00 (2011.01); B29C 43/02 (2006.01);
U.S. Cl.
CPC ...
G03F 7/0002 (2013.01); B29C 43/021 (2013.01); B82Y 10/00 (2013.01); B82Y 40/00 (2013.01);
Abstract

An imprint method for forming a pattern of an imprint material on a substrate-side pattern region of a substrate by using a mold. The method includes deforming a partial region of the substrate, the partial region corresponding to the substrate-side pattern region, by irradiating the substrate with light that has passed through the mold and has a first wavelength different from light having a second wavelength that is used for curing the imprint material, and curing the imprint material by irradiating the light having the second wavelength in a state in which the substrate-side pattern region is deformed and the mold is contacted with the imprint material. The step of deforming includes forming an uneven temperature distribution on the substrate-side pattern region by irradiation of the light having the first wavelength with an uneven illumination distribution.


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