The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11249345 B1

Date of Patent:

Feb. 15, 2022

Filed:

Jun. 29, 2021

White led package, light-emitting device, surface light source device and display device

Applicant:

Enplas Corporation, Saitama, JP;

Inventor:

Yuki Fujii, Saitama, JP;

Assignee:

Enplas Corporation, Saitama, JP;

Attorney:

Primary Examiner:

Mary Ellen Bowman

Int. Cl.

CPC ...

G02F 1/1335 (2006.01); H01L 25/075 (2006.01); G02F 1/13357 (2006.01); H01L 33/58 (2010.01); H01L 33/50 (2010.01);

U.S. Cl.

CPC ...

G02F 1/133607 (2021.01); G02F 1/133603 (2013.01); H01L 25/0753 (2013.01); H01L 33/50 (2013.01); H01L 33/58 (2013.01);

Abstract

Condition 1 (an absolute value of a difference between IB×B and EB×B is 55% or smaller) and condition 2 (an absolute value of a difference between IY×Y and EY×Y is 55% or smaller) are satisfied, where, when an area of the light-emitting surface is equally divided into inner and outer regions by a boundary line as an outer edge of a region similar in shape to the light-emitting surface in plan view of a white LED package, IB (%) is an area ratio of blue LED chips in the inner region; IY (%) is an area ratio of the region where no blue LED chips is disposed in the inner region; EB (%) is an area ratio of the blue LED chips in the outer region; and EY (%) is an area ratio of the region where no blue LED chip is disposed in the outer region.

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