The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2022

Filed:

Sep. 17, 2019
Applicant:

Applied Materials, Inc., Santa Clara, CA (US);

Inventors:

Joseph R. Johnson, Redwood City, CA (US);

Roger Quon, Rhinebeck, NY (US);

Assignee:

Applied Materials, Inc., Santa Clara, CA (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); G01N 33/487 (2006.01); B81B 1/00 (2006.01); B81C 3/00 (2006.01);
U.S. Cl.
CPC ...
G01N 33/48721 (2013.01); B81B 1/004 (2013.01); B81C 3/001 (2013.01); B81B 2201/0214 (2013.01); B81C 2201/019 (2013.01);
Abstract

Nanopore flow cells and methods of manufacturing thereof are provided herein. In one embodiment a method of forming a flow cell includes forming a multi-layer stack on a first substrate, e.g., a monocrystalline silicon substrate, before transferring the multi-layer stack to a second substrate, e.g., a glass substrate. Here, the multi-layer stack features a membrane layer, having a first opening formed therethrough, where the membrane layer is disposed on the first substrate, and a material layer is disposed on the membrane layer. The method further includes patterning the second substrate to form a second opening therein and bonding the patterned surface of the second substrate to a surface of the multi-layer stack. The method further includes thinning the first substrate and thinning the second substrate. Here, the second substrate is thinned to where the second opening is disposed therethrough. The method further includes removing the thinned first substrate and at least portions of the material layer to expose opposite surfaces of the membrane layer.


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