The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Jun. 09, 2017
Mitsubishi Electric Corporation, Tokyo, JP;
Yasuhiro Suzuki, Tokyo, JP;
Hirokazu Minamisako, Tokyo, JP;
Kazutaka Suzuki, Tokyo, JP;
Takafumi Mito, Tokyo, JP;
Taro Hattori, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
An apparatus using a heat pump includes a refrigerant circuit and a heat medium circuit. The refrigerant circuit is capable of performing a first operation, in which a load-side heat exchanger is used as a condenser, and a second operation, in which the load-side heat exchanger is used as an evaporator. A main circuit of the heat medium circuit has a branching part and a joining part. An overpressure protection device and a refrigerant leakage detecting device are connected to the main circuit. The overpressure protection device is connected to a connection part located between the load-side heat exchanger and one of the branching part and the joining part, or at the load-side heat exchanger. When leakage of refrigerant is detected, the state of a refrigerant flow switching device is set to a second state, an expansion device is set to a closed state, and a compressor is operated.