The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Apr. 14, 2017
Primetals Technologies Japan, Ltd., Hiroshima, JP;
Takashi Yonekura, Hiroshima, JP;
Masao Tambara, Hiroshima, JP;
Masashi Yoshikawa, Hiroshima, JP;
Shinya Kanemori, Hiroshima, JP;
Kazuki Yoshida, Hiroshima, JP;
PRIMETALS TECHNOLOGIES JAPAN, LTD., Tokyo, JP;
Abstract
When a portion for measuring the plating adhesion amount reaches an upstream side position, plating adhesion amount estimation values are calculated by using a plating adhesion amount estimation expression at positions away from a position that faces the distance sensors, that is, the upstream side position, by strip-width direction distances, of the surfaces of the steel strip. When the portion for measuring the plating adhesion amount reaches a downstream side position, the strip-width direction distances of the plating adhesion amount meters are matched to the strip-width direction distances, and the plating adhesion amount actual measurement values are obtained. The plating adhesion amount estimation expression is corrected on the basis of the differences between the plating adhesion amount estimation values and the plating adhesion amount actual measurement values. Accordingly, the control accuracy of the plating adhesion amount is improved.