The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Oct. 05, 2017
Applicant:
Shin-etsu Chemical Co., Ltd., Tokyo, JP;
Inventors:
Yasuhisa Ishihara, Annaka, JP;
Akihiro Endo, Annaka, JP;
Assignee:
SHIN-ETSU CHEMICAL CO., LTD., Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09K 5/14 (2006.01); C08G 77/04 (2006.01); C08K 3/22 (2006.01); C08K 3/28 (2006.01); C08K 7/18 (2006.01); C08L 83/04 (2006.01); C08K 13/04 (2006.01); C08K 3/013 (2018.01); C08K 13/00 (2006.01);
U.S. Cl.
CPC ...
C09K 5/14 (2013.01); C08G 77/04 (2013.01); C08K 3/013 (2018.01); C08K 3/22 (2013.01); C08K 3/28 (2013.01); C08K 7/18 (2013.01); C08K 13/00 (2013.01); C08K 13/04 (2013.01); C08L 83/04 (2013.01); C08K 2003/2227 (2013.01); C08K 2003/282 (2013.01); C08K 2201/001 (2013.01); C08K 2201/005 (2013.01); C08K 2201/014 (2013.01);
Abstract
A thermoconductive silicone composition which has (A) an organopolysiloxane as a base polymer and includes (B) a thermoconductive filler, wherein the thermoconductive filler is 60-85 vol % of the thermoconductive silicone composition, and 40-60 vol % of the thermoconductive filler is aluminum nitride having an average particle diameter of at least 50 μm.