The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2022

Filed:

Oct. 06, 2016
Applicant:

Sekisui Chemical Co., Ltd., Osaka, JP;

Inventors:

Juichi Fukatani, Osaka, JP;

Kiyomi Uenomachi, Osaka, JP;

Takazumi Okabayashi, Osaka, JP;

Ryousuke Ebina, Osaka, JP;

Atsushi Wada, Osaka, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 129/14 (2006.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); C09J 4/00 (2006.01); C08L 29/14 (2006.01); C08F 116/38 (2006.01); C08K 5/101 (2006.01); C08K 5/1515 (2006.01); C08K 5/07 (2006.01); C08K 5/00 (2006.01); B29K 105/00 (2006.01);
U.S. Cl.
CPC ...
C09J 129/14 (2013.01); C08F 116/38 (2013.01); C08K 5/0025 (2013.01); C08K 5/07 (2013.01); C08K 5/101 (2013.01); C08K 5/1515 (2013.01); C08L 29/14 (2013.01); C09J 4/00 (2013.01); C09J 7/10 (2018.01); C09J 7/30 (2018.01); B29K 2105/0097 (2013.01); C08K 5/0016 (2013.01); C09J 2301/304 (2020.08); C09J 2301/408 (2020.08); C09J 2301/416 (2020.08); C09J 2433/00 (2013.01);
Abstract

The present invention aims to provide a polyvinyl acetal resin composition that is moldable by an extrusion method and capable of exhibiting excellent heat resistance after molding, an adhesive sheet containing the polyvinyl acetal resin composition, and a method for producing the adhesive sheet. The present invention relates to a polyvinyl acetal resin composition including: a polyvinyl acetal; a reactive diluent; and a photopolymerization initiator, the polyvinyl acetal resin composition having a storage modulus G' at 200° C. before irradiation with light of 8×10Pa or lower and a storage modulus G′ at 200° C. after irradiation with light of 8×10Pa or higher, with the storage modulus G′ at 200° C. after irradiation with light being higher than the storage modulus G′ at 200° C. before irradiation with light.


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