The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2022

Filed:

Jul. 28, 2014
Applicant:

Dexerials Corporation, Tokyo, JP;

Inventor:

Yasushi Akutsu, Utsunomiya, JP;

Assignee:
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 9/02 (2006.01); C09J 11/04 (2006.01); H05K 3/32 (2006.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); H01R 43/16 (2006.01); C08K 7/18 (2006.01); C08K 3/04 (2006.01); C08K 3/08 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
C09J 9/02 (2013.01); C09J 7/22 (2018.01); C09J 7/30 (2018.01); C09J 11/04 (2013.01); H01R 43/16 (2013.01); H05K 3/323 (2013.01); C08K 3/04 (2013.01); C08K 3/08 (2013.01); C08K 7/18 (2013.01); C09J 2203/326 (2013.01); C09J 2301/314 (2020.08); C09J 2301/408 (2020.08); C09J 2433/00 (2013.01); C09J 2463/00 (2013.01); C09J 2467/006 (2013.01); H05K 3/361 (2013.01); H05K 2201/0224 (2013.01); H05K 2203/0139 (2013.01); H05K 2203/0534 (2013.01); H05K 2203/0545 (2013.01);
Abstract

Methods for securely transferring and attaching electrically conductive particles filled in openings to a binder resin layer. The methods include a step of filling a solvent and electrically conductive particles in a plurality of openings formed on a surface of a substrate in a predetermined pattern, a step of pasting a surface on which a binder resin layer is formed of an adhesive film having the binder resin layer formed on a base film on a surface on which the openings are formed of the substrate, and a step of peeling off the adhesive film from the surface of the substrate and transferring and attaching the electrically conductive particles filled in the openings to the binder resin layer while heating the substrate.


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