The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2022

Filed:

Jun. 08, 2018
Applicant:

C-bond Systems, Llc, Houston, TX (US);

Inventors:

Erik K. Koep, Houston, TX (US);

Vince Pugliese, Southlake, TX (US);

Bruce E. Rich, Houston, TX (US);

Andrew R. Barron, Swansea, GB;

Assignee:

C-Bond Systems, LLC, Houston, TX (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C03C 17/00 (2006.01); C03C 17/32 (2006.01); C09D 5/02 (2006.01); C09D 7/63 (2018.01); C09D 133/06 (2006.01); C08K 5/09 (2006.01);
U.S. Cl.
CPC ...
C03C 17/328 (2013.01); C03C 17/002 (2013.01); C03C 17/005 (2013.01); C03C 17/006 (2013.01); C09D 5/022 (2013.01); C09D 5/025 (2013.01); C09D 7/63 (2018.01); C09D 133/06 (2013.01); C03C 2217/20 (2013.01); C03C 2217/78 (2013.01); C03C 2218/112 (2013.01); C03C 2218/32 (2013.01); C08K 5/09 (2013.01);
Abstract

The present invention provides, in various embodiments, compositions and methods for strengthening glass without heat or chemical processing of the glass itself. The compositions of the present invention are emulsions comprising polymer colloid particles that are functionalized with an organosilicon compound. The polymer colloid particles can fill surface defects in the glass due to their size being smaller than the surface defects, and the functional groups thereon can react with the surface of the glass to anchor the particles in the defects.


Find Patent Forward Citations

Loading…