The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 15, 2022

Filed:

Jun. 08, 2020
Applicant:

3d Systems, Inc., Rock Hill, SC (US);

Inventors:

Jessica Lisagor, Olympic Valley, CA (US);

Andrew R Miller, The Woodlands, TX (US);

Martin Johnson, Rock Hill, SC (US);

Nickalaus Podgursky, Huntersville, NC (US);

Leigh Herran, Charlotte, NC (US);

Assignee:

3D Systems, Inc., Rock Hill, SC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
B29C 70/78 (2006.01); B29C 64/245 (2017.01); B29C 64/118 (2017.01); B29C 64/106 (2017.01); B29K 67/00 (2006.01); B29K 667/00 (2006.01);
U.S. Cl.
CPC ...
B29C 70/78 (2013.01); B29C 64/106 (2017.08); B29C 64/118 (2017.08); B29C 64/245 (2017.08); B29K 2067/046 (2013.01); B29K 2667/046 (2013.01); B29K 2713/00 (2013.01);
Abstract

Thermoplastic 3D objects are printed directly onto permeable materials with a high strength bond. The 3D object can be attached to the permeable material at one side where the bottom layer of the 3D object can be attached to the permeable material or alternatively, at an internal layer where portions of the 3D object are on opposite sides of the permeable material. In order to improve the adhesion of the 3D object to the permeable material, the bonding layer of the liquid thermoplastic material that is printed directly onto the permeable material can be deposited at modified 3D printer settings that can include a hotter than normal material deposition temperature. Additional build layers of the liquid thermoplastic material are printed on the bonding layer to complete the 3D objects.


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