The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 15, 2022
Filed:
Mar. 15, 2018
The Boeing Company, Chicago, IL (US);
Toray Industries, Inc., Tokyo, JP;
Karl M. Nelson, Issaquah, WA (US);
Travis James Sherwood, Seattle, WA (US);
Hardik Dalal, Seattle, WA (US);
Felix N. Nguyen, Des Moines, WA (US);
Dongyeon Lee, Puyallup, WA (US);
Kenichi Yoshioka, Puyallup, WA (US);
Hideo Andrew Koyanagi, Bellevue, WA (US);
The Boeing Company, Chicago, IL (US);
Toray Industries, Inc., Tokyo, JP;
Abstract
Methods of co-bonding a first thermoset composite (TSC) and a second TSC to define a cured composite part are disclosed herein. The methods include partially curing the first TSC to a target state of cure (SOC) to define a first partially cured TSC. The partially curing is based, at least in part, on a maximum temperature of the first TSC during the partially curing and on an elapsed time that an actual temperature of the first TSC is greater than a threshold temperature. The methods further include combining the first partially cured TSC with the second TSC to define a partially cured TSC assembly and heating the partially cured TSC assembly to bond the first partially cured TSC to the second TSC, cure the partially cured TSC assembly, and produce a cured composite part.