The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Jun. 29, 2020
Applicants:

Qing Ding Precision Electronics (Huaian) Co., Ltd, Huai an, CN;

Avary Holding (Shenzhen) Co., Limited., Shenzhen, CN;

Inventors:

Wen-Qiang Chen, Huaian, CN;

Ming-Hua Du, Qinhuangdao, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H05K 1/05 (2006.01); H05K 3/40 (2006.01); H05K 3/34 (2006.01); H05K 3/12 (2006.01); F21V 23/00 (2015.01);
U.S. Cl.
CPC ...
H05K 3/4007 (2013.01); H05K 3/1258 (2013.01); H05K 3/3436 (2013.01); F21V 23/004 (2013.01);
Abstract

A circuit board having a high reflectivity includes a wiring board, a first solder resist layer, and a second solder resist layer. The wiring board includes a wiring layer on an outer side, the wiring layer including wiring and a bond pad spaced from the wiring. The first solder resist layer, with opening and groove, covers the wiring layer, the bond pad is exposed from the opening but spaced from the first solder resist layer. The second solder resist layer infills the groove and covers the first solder resist layer but does not make contact with the mounting surface of the bond pad. A method for manufacturing such circuit board is also disclosed.


Find Patent Forward Citations

Loading…