The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Apr. 03, 2019
Applicant:

Sony Semiconductor Solutions Corporation, Kanagawa, JP;

Inventors:

Yuta Momiuchi, Kanagawa, JP;

Yuji Takaoka, Kanagawa, JP;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
H04N 5/369 (2011.01); H04N 5/225 (2006.01); H04N 5/345 (2011.01); H01L 27/146 (2006.01); G03B 17/02 (2021.01);
U.S. Cl.
CPC ...
H04N 5/369 (2013.01); G03B 17/02 (2013.01); H01L 27/146 (2013.01); H01L 27/14618 (2013.01); H01L 27/14636 (2013.01); H04N 5/225 (2013.01); H04N 5/345 (2013.01);
Abstract

A rewiring region is provided in a region other than a pixel region on a front face (pixel formation surface) FA of an imaging element. A mold part is formed around the imaging element other than on the front face FA. Rewiring layers that connect an external terminal and a pad provided in the rewiring region are formed via insulating layers on a side of the pixel formation surface of the imaging element and the mold part. Therefore, connection to a substrate can be made possible even if the spacing between the pads is narrowed, a mounting surface of an imaging device is also on the side of the pixel formation surface, and reduction in size and height can be achieved.


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