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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11245175 B1

PDFFull Text
Date of Patent:
Feb. 08, 2022

Filed:

Sep. 27, 2018

Antenna module configurations

Applicant:

Qualcomm Incorporated, San Diego, CA (US);

Inventors:

Seong Heon Jeong, Tuscaloosa, AL (US);

Rajneesh Kumar, San Diego, CA (US);

Mohammad Ali Tassoudji, San Diego, CA (US);

Darryl Jessie, San Diego, CA (US);

Gurkanwal Sahota, San Diego, CA (US);

Kevin Hsi Huai Wang, San Diego, CA (US);

Jeong Il Kim, San Diego, CA (US);

Taesik Yang, San Diego, CA (US);

Thomas Myers, San Diego, CA (US);

Neil Burns, San Diego, CA (US);

Julio Zegarra, La Jolla, CA (US);

Clinton James Wilber, San Diego, CA (US);

Jordan Szabo, Carlsbad, CA (US);

Assignee:

QUALCOMM Incorporated, San Diego, CA (US);

Attorney:

Qualcomm Incorporated

Primary Examiner:

Graham P Smith

Int. Cl.
CPC ...
H01Q 1/24 (2006.01); H01Q 1/22 (2006.01); H01L 25/065 (2006.01); H01L 23/28 (2006.01); H01L 23/552 (2006.01); H01L 23/64 (2006.01); H01L 23/66 (2006.01); H01Q 1/52 (2006.01); H01Q 9/06 (2006.01); H01Q 9/26 (2006.01); H01Q 21/28 (2006.01); H01L 23/31 (2006.01); H01Q 9/04 (2006.01);
U.S. Cl.
CPC ...
H01Q 1/2283 (2013.01); H01L 23/28 (2013.01); H01L 23/552 (2013.01); H01L 23/645 (2013.01); H01L 23/66 (2013.01); H01L 25/0655 (2013.01); H01Q 1/243 (2013.01); H01Q 1/526 (2013.01); H01L 23/3121 (2013.01); H01L 2223/6677 (2013.01); H01L 2224/16225 (2013.01); H01Q 9/0407 (2013.01); H01Q 9/065 (2013.01); H01Q 9/26 (2013.01); H01Q 21/28 (2013.01);
Abstract

An antenna module is described. The antenna module include a ground plane in a multilayer substrate. The antenna module also includes a mold on the multilayer substrate. The antenna module further includes a conductive wall separating a first portion of the mold from a second portion of the mold. The conductive wall is electrically coupled to the ground plane. A conformal shield may be placed on a surface of the second portion of the mold. The conformal shield is electrically coupled to the ground plane.

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