The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Sep. 15, 2020
Applicant:

Nichia Corporation, Anan, JP;

Inventors:

Takashi Ishii, Tokushima, JP;

Dai Wakamatsu, Komatsushima, JP;

Hiroaki Kageyama, Tokushima, JP;

Assignee:

NICHIA CORPORATION, Anan, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/00 (2006.01); H01L 25/075 (2006.01); H01L 33/00 (2010.01);
U.S. Cl.
CPC ...
H01L 25/0753 (2013.01); H01L 33/0095 (2013.01); H01L 2933/005 (2013.01); H01L 2933/0058 (2013.01);
Abstract

A method of manufacturing a light-emitting module that includes providing a light-transmissive member joined body that includes a plurality of submounts, a plurality of light-emitting elements each of which is disposed on a respective one of submounts, and a single light-transmissive member disposed on the light-emitting elements. The method further includes disposing the light-transmissive member joined body on a module board such that the submounts face the module board, forming a plurality of element structures by dividing the single light-transmissive member for each light-emitting element into the element structures each of which includes the submount, the light-emitting element, and the light-transmissive member positioned in this order, and forming a first covering member on the module board to cover lateral surfaces of the element structures.


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