The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
Feb. 24, 2020
Fuji Electric Co., Ltd., Kawasaki, JP;
Yoshihiro Yasuda, Matsumoto, JP;
Kenpei Nakamura, Matsumoto, JP;
FUJI ELECTRIC CO., LTD., Kawasaki, JP;
Abstract
A semiconductor device includes a semiconductor element, a bonding wire that is electrically connected to the semiconductor element, a connection terminal, and sealing material that seals the semiconductor element, the bonding wire, and a part of the connection terminal. In addition, the connection terminal includes a plate-shaped lead part having a bonding area to which the bonding wire is bonded and an anchor part protruding from a first side part of the lead part. In the semiconductor device, since the rear surface of a die pad and the rear surface of the lead part exposed to the outside in a sealing main surface of the sealing material occupy a predetermined area or more, the heat dissipation of the semiconductor device is improved.