The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Jul. 20, 2020
Applicant:

Softbank Corp., Tokyo, JP;

Inventors:

Takashi Tsutsui, Tokyo, JP;

Shigenori Imanaka, Tokyo, JP;

Tomohiko Furutani, Tokyo, JP;

Assignee:

SoftBank Corp., Tokyo, JP;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 23/44 (2006.01); H01L 23/32 (2006.01); H01L 23/473 (2006.01); H01L 25/18 (2006.01);
U.S. Cl.
CPC ...
H01L 23/44 (2013.01); H01L 23/32 (2013.01); H01L 23/473 (2013.01); H01L 25/18 (2013.01);
Abstract

A three-dimensional stacked integrated circuit includes a plurality of interposers between respective integrated circuits of the three-dimensional stacked integrated circuit and below a lowermost integrated circuit, wherein a plurality of movement paths of a coolant are respectively provided in the plurality of interposers, and the plurality of movement paths of the coolant provided in the plurality of interposers are connected to each other. Alternatively, the three-dimensional stacked integrated circuit is configured by immersion and the system thereof is simplified by the coolant interacting with the outside in grooves provided to the edges of the interposers. In this case, a path for allowing the coolant to flow in the layer direction is not necessary.


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