The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
Mar. 16, 2018
Applicant:
Mitsubishi Electric Corporation, Tokyo, JP;
Inventor:
Koichiro Nishizawa, Tokyo, JP;
Assignee:
Mitsubishi Electric Corporation, Tokyo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/50 (2006.01); H01L 23/04 (2006.01); H01L 23/10 (2006.01); H01L 23/00 (2006.01); H05K 3/36 (2006.01);
U.S. Cl.
CPC ...
H01L 23/041 (2013.01); H01L 21/50 (2013.01); H01L 23/10 (2013.01); H01L 24/05 (2013.01); H01L 24/13 (2013.01); H01L 24/73 (2013.01); H05K 3/36 (2013.01); H01L 2224/13582 (2013.01);
Abstract
A device () is formed on a main surface of a substrate (). The main surface of the substrate () is bonded to the undersurface of the counter substrate () via the bonding member () in a hollow state. A circuit () and a bump structure () are formed on the top surface of the counter substrate (). The bump structure () is positioned in a region corresponding to at least the bonding member (), and has a higher height than that of the circuit ().