The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
May. 28, 2018
Mitsubishi Electric Corporation, Tokyo, JP;
Kazuhiro Maeda, Tokyo, JP;
Mitsubishi Electric Corporation, Tokyo, JP;
Abstract
A resin membrane () covering a semiconductor device () and a dicing line () of a semiconductor substrate () is formed on a main surface of the semiconductor substrate (). The resin membrane () around the first electrode () is removed and the resin membrane () on the second electrode () is removed to form a first contact hole () without removing the resin membrane () on the dicing line (). A resin film () is applied to a top surface of the resin membrane () to form a hollow structure () around the first electrode (). The resin film () is patterned to form a second contact hole () connected to the first contact hole () and a first opening () above the dicing line () simultaneously. After forming the first opening (), the semiconductor substrate () is diced along the dicing line ().