The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Jan. 06, 2021
Applicant:

Shanghai Huali Microelectronics Corporation, Shanghai, CN;

Inventor:

Aimei Lin, Shanghai, CN;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H01L 21/311 (2006.01); C23C 16/34 (2006.01); C23C 16/40 (2006.01); H01L 21/033 (2006.01); C23C 16/56 (2006.01); C23C 16/455 (2006.01); H01L 21/308 (2006.01);
U.S. Cl.
CPC ...
H01L 21/31144 (2013.01); C23C 16/345 (2013.01); C23C 16/401 (2013.01); C23C 16/45529 (2013.01); C23C 16/56 (2013.01); H01L 21/0332 (2013.01); H01L 21/0337 (2013.01); H01L 21/0338 (2013.01); H01L 21/3086 (2013.01); H01L 21/31111 (2013.01);
Abstract

The present disclosure provides a self-aligned two-time forming method capable of preventing sidewalls from being deformed, comprises sequentially growing a first silicon nitride layer, a first silicon oxide layer, a titanium nitride layer, a second silicon oxide layer, a second silicon nitride layer and a polysilicon layer on a via layer from bottom to top; defining a pattern by using the polysilicon layer as a hard mask, and etching the second silicon nitride layer to an upper surface of the second silicon oxide layer to form a plurality of silicon nitride pattern structures from the second silicon nitride layer; forming sidewalls on sidewalls of the plurality of silicon nitride pattern structures; removing the silicon nitride pattern structures in the sidewalls; etching the silicon nitride layer and the titanium nitride layer by using the sidewalls as a hard mask to form a titanium nitride pattern structure.


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