The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Sep. 16, 2020
Applicant:

Palo Alto Research Center Incorporated, Palo Alto, CA (US);

Inventors:

Aleksandar B. Feldman, Santa Cruz, CA (US);

Morad Behandish, Foster City, CA (US);

Johan de Kleer, Los Altos, CA (US);

Ion Matei, Sunnyvale, CA (US);

Saigopal Nelaturi, Mountain View, CA (US);

Assignee:
Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
G06F 30/337 (2020.01); G06F 115/12 (2020.01); G06F 7/24 (2006.01); G06F 111/04 (2020.01);
U.S. Cl.
CPC ...
G06F 30/337 (2020.01); G06F 7/24 (2013.01); G06F 2111/04 (2020.01); G06F 2115/12 (2020.01);
Abstract

One embodiment can provide a system for determining a hybrid-manufacturing process plan for manufacturing a printed circuit board (PCB). During operation, the system can obtain a set of hybrid-manufacturing constraints. The set of hybrid-manufacturing constraints can include a set of primitives, a set of atoms, and an atom end-state vector. A primitive can represent an additive or a subtractive manufacturing process corresponding to one or more atoms of the PCB. An atom can correspond to a unit of spatial volume of the PCB. The system can determine a plurality of feasible hybrid-manufacturing plans based on the set of hybrid-manufacturing constraints. Each feasible hybrid-manufacturing plan can represent an ordering of the set of primitives satisfying the atom end-state vector. The system can determine costs for manufacturing the PCB using the plurality of feasible hybrid-manufacturing plans. The system can determine, based on the costs, an optimized hybrid-manufacturing plan for manufacturing the PCB.


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