The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Jul. 17, 2020
Applicant:

Infineon Technologies Ag, Neubiberg, DE;

Inventors:

Manuel Gillinger, Feldkirchen, AT;

Wolfgang Granig, Seeboden, AT;

Attorney:
Primary Examiner:
Assistant Examiner:
Int. Cl.
CPC ...
G01R 33/07 (2006.01); G01R 33/00 (2006.01); G01R 33/09 (2006.01);
U.S. Cl.
CPC ...
G01R 33/0035 (2013.01); G01R 33/0052 (2013.01); G01R 33/0082 (2013.01); G01R 33/07 (2013.01); G01R 33/095 (2013.01);
Abstract

A packaged sensor chip includes a lead frame to which there is attached a sensor element designed to generate a sensor signal that depends on a magnetic field to which the sensor element is exposed; and a package therefor, wherein the lead frame has function terminals and wherein the lead frame has at least two calibration terminals that are arranged on two other opposing sides of the package, wherein the lead frame has conductive structures that connect the at least two calibration terminals, wherein the conductive structures are structured so as to generate a calibration magnetic field for the sensor element when a current flows through them, and wherein the conductive structures are part of a connection structure that connects a plurality of lead frames before the plurality of lead frames are disconnected from one another in a first direction in which the other two sides are opposite one another.


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