The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Dec. 19, 2017
Applicant:

Arm Limited, Cambridge, GB;

Inventors:

James Edward Myers, Cambridge, GB;

John Philip Biggs, Cambridge, GB;

Jedrzej Kufel, Cambridge, GB;

Assignee:

Arm Limited, Cambridge, GB;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
G01R 31/317 (2006.01); G01R 31/3183 (2006.01); H01L 21/66 (2006.01); H01L 25/00 (2006.01);
U.S. Cl.
CPC ...
G01R 31/31718 (2013.01); G01R 31/3183 (2013.01); G01R 31/31721 (2013.01); H01L 22/34 (2013.01); H01L 25/50 (2013.01);
Abstract

Integrated circuits () are manufactured by printing an array of circuit elements CE each containing an integrated circuit and associated testing circuitry (). A plurality of integrated circuits within the array are tested in parallel to generate a corresponding plurality of individual test result signals. These individual test result signals are combined to form a combined test result signal indicating whether any of the plurality of integrated circuits tested in parallel operated incorrectly during their testing. If the combined test result signal indicates any faulty integrated circuits, then the entire plurality of integrated circuits (e.g. an entire row or column) may be discarded. The array of tested integrated circuits are then separated into discrete integrated circuits and are also separated from their testing circuit. Contacts () providing power signals, clock signals, and the reading of the combined test result signals are located at the periphery of a substrate sheet onto which the array of circuit elements are printed.


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