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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11242619 B1

PDFFull Text
Date of Patent:
Feb. 08, 2022

Filed:

Nov. 13, 2020

Nano-twinned copper layer, method for manufacturing the same, and substrate comprising the same

Applicant:

Chemleader Corporation, Hsinchu County, TW;

Inventors:

Chih-Hung Bai, Hsinchu County, TW;

Yao-Tsung Chen, Hsinchu County, TW;

Zong-Cyuan Chen, Hsinchu County, TW;

Shih-Chun Chung, Hsinchu County, TW;

Assignee:

CHEMLEADER CORPORATION, Hsinchu County, TW;

Attorney:

Bacon & Thomas, PLLC

Primary Examiner:

Seth Dumbris

Int. Cl.
CPC ...
B32B 15/00 (2006.01); C30B 29/60 (2006.01); C30B 29/10 (2006.01); C30B 7/12 (2006.01); C25D 5/00 (2006.01); C25D 3/38 (2006.01); H01L 23/498 (2006.01); H05K 1/09 (2006.01); H01B 5/14 (2006.01);
U.S. Cl.
CPC ...
C30B 29/605 (2013.01); C25D 3/38 (2013.01); C25D 5/617 (2020.08); C30B 7/12 (2013.01); C30B 29/10 (2013.01); H01B 5/14 (2013.01); H01L 23/49866 (2013.01); H05K 1/09 (2013.01);
Abstract

A nano-twinned copper layer is disclosed, wherein over 50% of a volume of the nano-twinned copper layer comprises a plurality of columnar crystal grains, the plurality of columnar crystal grains connect to each other, at least 70% of the plurality of columnar crystal grains are formed by a plurality of nano-twins stacking in an orientation of a crystal axis, and an angle included between two adjacent columnar crystal grains is greater 20° and less than or equal to 60°. In addition, a method for manufacturing the nano-twinned copper layer and a substrate comprising the same are also disclosed.

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Bai, Chih-Hung. (2022). Nano-twinned copper layer, method for manufacturing the same, and substrate comprising the same (U.S. Patent No. 11242619). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11242619

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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