The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
Dec. 02, 2014
Applicant:
Sumitomo Seika Chemicals Co., Ltd., Hyogo, JP;
Inventors:
Assignee:
SUMITOMO SEIKA CHEMICALS CO., LTD., Hyogo, JP;
Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C09J 163/00 (2006.01); C08L 23/06 (2006.01); C09J 11/08 (2006.01);
U.S. Cl.
CPC ...
C09J 163/00 (2013.01); C08L 23/06 (2013.01);
Abstract
The present invention provides an epoxy resin adhesive that exhibits low shrinkage and excellent adhesiveness. The epoxy resin adhesive includes (A) an epoxy resin, (B) a curing agent, and (C) a particulate polyolefin-based resin having a volume average particle size of 1 to 25 μm, wherein the particulate polyolefin-based resin is spherical, and wherein the particulate polyolefin-based resin is present in an amount of 1 to 50 parts by mass per 100 parts by mass of the epoxy resin.