The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Oct. 25, 2017
Applicant:

Essilor International, Charenton-le-Pont, FR;

Inventors:

Robert Valeri, Dallas, TX (US);

Haipeng Zheng, Carrollton, TX (US);

Matthew Freeman, Spring, TX (US);

Assignee:

Essilor International, Charenton-le-Pont, FR;

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
C08G 59/22 (2006.01); C08G 59/36 (2006.01); C08G 59/40 (2006.01); C08L 63/00 (2006.01); C09D 163/00 (2006.01); G02B 1/04 (2006.01);
U.S. Cl.
CPC ...
C08G 59/223 (2013.01); C08G 59/36 (2013.01); C08G 59/4085 (2013.01); C08L 63/00 (2013.01); C09D 163/00 (2013.01); G02B 1/041 (2013.01);
Abstract

The present invention relates to a heat-curable composition comprising at least one epoxy monomer comprising two or three epoxy groups, which is not a hydrolysis-polymerizable silicon compound, at least one epoxy compound bearing at least one silicon atom having at least one hydrolyzable group directly linked to the silicon atom and at least one epoxy group, and at least one epoxy ring-opening catalyst. The composition comprises at least 50% by weight of compounds having at least one epoxy group, relative to the total weight of polymerizable compounds present in the composition and provides upon pre-curing a tack-free coating that can be removed by treatment with a solution of sodium hydroxide, and upon post-curing a coating that cannot be removed by treatment with a solution of sodium hydroxide.


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