The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 08, 2022

Filed:

Oct. 20, 2015
Applicant:

Ppg Industries Ohio, Inc., Cleveland, OH (US);

Inventors:

Masayuki Nakajima, Wexford, PA (US);

Hongying Zhou, Allison Park, PA (US);

Tien-Chieh Chao, Mars, PA (US);

Shanti Swarup, Allison Park, PA (US);

Assignee:

PPG Industries Ohio, Inc., Cleveland, OH (US);

Attorneys:
Primary Examiner:
Int. Cl.
CPC ...
C08G 8/10 (2006.01); C09J 161/06 (2006.01); C08G 8/28 (2006.01); C08K 5/17 (2006.01); C08L 61/14 (2006.01); C08G 14/06 (2006.01); C08L 61/34 (2006.01); C09J 161/14 (2006.01); C09J 161/34 (2006.01); C09J 163/00 (2006.01); C08L 63/00 (2006.01); C08G 59/62 (2006.01); C08L 9/00 (2006.01); C08L 61/06 (2006.01); C09J 5/06 (2006.01); C09J 109/00 (2006.01);
U.S. Cl.
CPC ...
C08G 8/10 (2013.01); C08G 8/28 (2013.01); C08G 14/06 (2013.01); C08G 59/621 (2013.01); C08K 5/17 (2013.01); C08L 9/00 (2013.01); C08L 61/06 (2013.01); C08L 61/14 (2013.01); C08L 61/34 (2013.01); C08L 63/00 (2013.01); C09J 5/06 (2013.01); C09J 109/00 (2013.01); C09J 161/06 (2013.01); C09J 161/14 (2013.01); C09J 161/34 (2013.01); C09J 163/00 (2013.01); C09J 2409/00 (2013.01);
Abstract

An adhesive composition is disclosed. The adhesive composition comprises an epoxy-containing component; rubber particles having a core-shell structure; and a curing component comprising a mixture of an amine-containing compound substantially free of hydroxyl functional groups and a polymeric phenol-containing compound, wherein the amine-containing compound comprises primary and/or secondary amino groups, and wherein the curing component chemically reacts with the epoxy-containing component upon activation from an external energy source. Also disclosed are methods of preparing the adhesive composition and for forming a bonded substrate with the adhesive composition. Further disclosed are curing components for an adhesive composition and methods of making the curing components.


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