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The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Patent No.:

US 11241841 B1

PDFFull Text
Date of Patent:
Feb. 08, 2022

Filed:

Mar. 12, 2021

Systems and methods for greater inter-layer bond integrity in additive manufacturing

Applicant:

Thermwood Corporation, Dale, IN (US);

Inventors:

Kenneth J. Susnjara, Birdseye, IN (US);

Brian S. Smiddy, Newburgh, IN (US);

Jonathan I. Fuquay, Boonville, IN (US);

Joshua A. Lough, Chrisney, IN (US);

Assignee:

Thermwood Corporation, Dale, IN (US);

Attorney:

Bookoff McAndrews, PLLC

Primary Examiner:

Matthew J Daniels

Assistant Examiner:

Andrew L Swanson

Int. Cl.
CPC ...
B29C 64/393 (2017.01); B29C 64/118 (2017.01); B33Y 50/02 (2015.01); B33Y 30/00 (2015.01); B33Y 10/00 (2015.01); B29C 64/386 (2017.01);
U.S. Cl.
CPC ...
B29C 64/393 (2017.08); B29C 64/118 (2017.08); B33Y 10/00 (2014.12); B33Y 30/00 (2014.12); B33Y 50/02 (2014.12); B29C 64/386 (2017.08);
Abstract

An additive manufacturing apparatus includes an extruder configured to receive a thermoplastic material and an applicator assembly downstream of the extruder, the applicator assembly including a nozzle for depositing the thermoplastic material as a plurality of layers. The additive manufacturing apparatus also includes a temperature sensor configured to detect a temperature of at least a portion of a deposited layer and a positioning assembly configured to change an angular position of the temperature sensor.

Find Patent Forward Citations

Susnjara, Kenneth. (2022). Systems and methods for greater inter-layer bond integrity in additive manufacturing (U.S. Patent No. 11241841). U.S. Patent and Trademark Office. https://idiyas.com/patent/badge/11241841

Data source: USPTO (United States Patent and Trademark Office) public patent records. Weekly synchronization. How IDiyas builds this profile

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