The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.
The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.
Patent No.:
Date of Patent:
Feb. 08, 2022
Filed:
Apr. 13, 2017
Asahi Kasei Kabushiki Kaisha, Tokyo, JP;
Kazuharu Yasuda, Tokyo, JP;
Yuo Umei, Tokyo, JP;
Hideaki Ichiki, Tokyo, JP;
Susumu Sugano, Tokyo, JP;
Asahi Kasei Kabushiki Kaisha, Tokyo, JP;
Abstract
A molding die and a molding method are provided, which allow high-cycle manufacturing of molded bodies of a thermoplastic resin or thermoplastic resin-fiber composite material, thereby improving productivity. Molding is performed using a molding die including a plurality of die portions that form a cavity in which a molded body is molded, the molding die including: a first temperature adjusting unit disposed in the vicinity of the cavity surface and capable of at least cooling the cavity surface; and a second temperature adjusting unit disposed on a side of the first temperature adjusting unit opposite from the cavity surface and capable of at least heating the cavity surface, wherein a distance Lfrom the cavity surface to the first temperature adjusting unit and a distance Lfrom the cavity surface to a surface of the corresponding die portion opposite from the cavity surface satisfy the relationship: (L/L)>3.