The patent badge is an abbreviated version of the USPTO patent document. The patent badge does contain a link to the full patent document.

The patent badge is an abbreviated version of the USPTO patent document. The patent badge covers the following: Patent number, Date patent was issued, Date patent was filed, Title of the patent, Applicant, Inventor, Assignee, Attorney firm, Primary examiner, Assistant examiner, CPCs, and Abstract. The patent badge does contain a link to the full patent document (in Adobe Acrobat format, aka pdf). To download or print any patent click here.

Date of Patent:
Feb. 01, 2022

Filed:

Feb. 16, 2021
Applicant:

Commscope Technologies Llc, Hickory, NC (US);

Inventors:

Michael Pollman, Londonderry, NH (US);

Kevin E. Craig, Dudley, MA (US);

David Davies, Chelmsford, MA (US);

Assignee:

CommScope Technologies LLC, Hickory, NC (US);

Attorney:
Primary Examiner:
Int. Cl.
CPC ...
H04B 7/022 (2017.01); H01Q 1/38 (2006.01); H01Q 21/24 (2006.01); H01Q 23/00 (2006.01); H01Q 1/22 (2006.01); H01Q 1/24 (2006.01); H04B 7/0413 (2017.01);
U.S. Cl.
CPC ...
H04B 7/022 (2013.01); H01Q 1/38 (2013.01); H01Q 21/24 (2013.01); H01Q 1/2291 (2013.01); H01Q 1/246 (2013.01); H01Q 23/00 (2013.01); H04B 7/0413 (2013.01);
Abstract

MIMO antenna modules and antenna units for a wireless communication system are provided. In one embodiment, a remote unit comprises: a controller module, comprising: a first substrate having a first ground plane, control circuitry and interface circuitry on the first substrate, a first connection region formed in the first substrate; and at least one antenna module coupled to the controller module, the antenna module comprising: a second substrate having a second ground plane, antennas on the second substrate, a second connection region on the second substrate and coupled to the interface circuitry via the first connection region, wherein the second connection region communicates data between the interface circuitry and the antennas, and a set of ground-plane contacts on the second substrate that electrically couple the first ground plane to the second ground plane of the second substrate when the second connector region is engaged with the first connector region.


Find Patent Forward Citations

Loading…